Our automated Surface Mount Technology (SMT) lines deliver high-precision component placement with absolute reliability. We accommodate ultra-fine pitch components, dual-sided boards, and complex multi-layer configurations. Dual-head high-accuracy placement. Capable of placing components from 01005 chips up to 50x50mm package sizes. Package pitch down to 0.2mm (BGA, QFN, CSP).
- PIC & microcontrollers
- Microprocessors
- Digital embedded controls
- Ethernet & USB interfaces
- Wireless & Bluetooth integration
- Battery & mains-powered systems
- Serial communications
- Signal processing (8-bit, 16-bit, 32-bit)



